品牌:
TE Connectivity (泰科)(36)
Samtec (申泰电子)(364)
Molex (莫仕)(15)
Preci-Dip Durtal Sa(5)
Weidmuller (魏德米勒)(6)
3M(2)
FCI Electronics (法马通)(36)
Kyocera (京瓷)(2)
Harwin(1)
Amphenol (安费诺)(33)
多选
封装:
-(10)
Solder(245)
Surface Mount(32)
Through Hole(153)
(46)
6(2)
PCB(2)
29(1)
Board(1)
8(2)
throughHole(3)
2.54 mm(3)
多选
包装:
Box(5)
Bulk(230)
Tape & Reel (TR)(43)
(175)
-(1)
Tube(33)
Tray(11)
Tape(1)
Bag(1)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式,用偏光墙, 3电路, 0.76μm ( 30μ ),金(Au )选择性电镀,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Kinked PC Tails
    8564
    5-24
    2.5920
    25-49
    2.4000
    50-99
    2.2656
    100-499
    2.2080
    500-2499
    2.1696
    2500-4999
    2.1216
    5000-9999
    2.1024
    ≥10000
    2.0736
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式,用偏光墙, 4回路, 0.76μm ( 30μ ),金(Au )选择性电镀,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Kinked PC Tails
    8565
    5-24
    3.3615
    25-49
    3.1125
    50-99
    2.9382
    100-499
    2.8635
    500-2499
    2.8137
    2500-4999
    2.7515
    5000-9999
    2.7266
    ≥10000
    2.6892
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式,用偏光墙, 4回路, 0.38μm ( 15μ ),金(Au )选择性电镀,与Backwalls删除 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Backwalls Removed
    7673
    5-24
    2.9430
    25-49
    2.7250
    50-99
    2.5724
    100-499
    2.5070
    500-2499
    2.4634
    2500-4999
    2.4089
    5000-9999
    2.3871
    ≥10000
    2.3544
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式,用偏光墙, 5电路, 0.38μm ( 15μ ),金(Au )选择性电镀 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 5 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
    3080
    5-24
    3.6450
    25-49
    3.3750
    50-99
    3.1860
    100-499
    3.1050
    500-2499
    3.0510
    2500-4999
    2.9835
    5000-9999
    2.9565
    ≥10000
    2.9160
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式,用偏光墙, 6电路,锡(Sn )镀层。与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 6 Circuits, Tin (Sn) Plating. with Kinked PC Tails
    5871
    5-24
    1.8630
    25-49
    1.7250
    50-99
    1.6284
    100-499
    1.5870
    500-2499
    1.5594
    2500-4999
    1.5249
    5000-9999
    1.5111
    ≥10000
    1.4904
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式,用偏光墙, 3电路, 0.38μm ( 15μ ),金(Au )选择性电镀,与Backwalls删除 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Backwalls Removed
    5568
    5-24
    2.2545
    25-49
    2.0875
    50-99
    1.9706
    100-499
    1.9205
    500-2499
    1.8871
    2500-4999
    1.8454
    5000-9999
    1.8287
    ≥10000
    1.8036
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式,用偏光墙, 5电路,锡(Sn )镀层 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, with Polarizing Wall, 5 Circuits, Tin (Sn) Plating
    9247
    5-24
    1.7820
    25-49
    1.6500
    50-99
    1.5576
    100-499
    1.5180
    500-2499
    1.4916
    2500-4999
    1.4586
    5000-9999
    1.4454
    ≥10000
    1.4256
  • 描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 36电路,锡(Sn )镀层,配合针脚长度6.09毫米( 0.240 ) 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 36 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm (.240)
    4950
    5-24
    5.6295
    25-49
    5.2125
    50-99
    4.9206
    100-499
    4.7955
    500-2499
    4.7121
    2500-4999
    4.6079
    5000-9999
    4.5662
    ≥10000
    4.5036
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 33电路,锡(Sn )镀层,配合针脚长度6.09毫米( 0.240 ) 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 33 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm (.240)
    9176
    10-99
    6.7560
    100-499
    6.4182
    500-999
    6.1930
    1000-1999
    6.1817
    2000-4999
    6.1367
    5000-7499
    6.0804
    7500-9999
    6.0354
    ≥10000
    6.0128
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 36电路,锡(Sn )镀层,配合针脚长度7.49毫米( 0.295 ) 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 36 Circuits, Tin (Sn) Plating, Mating Pin Length 7.49mm (.295)
    7160
    5-24
    6.5880
    25-49
    6.1000
    50-99
    5.7584
    100-499
    5.6120
    500-2499
    5.5144
    2500-4999
    5.3924
    5000-9999
    5.3436
    ≥10000
    5.2704
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 32电路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( 0.240 ) 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240)
    3209
    5-49
    12.5073
    50-199
    11.9728
    200-499
    11.6735
    500-999
    11.5987
    1000-2499
    11.5238
    2500-4999
    11.4383
    5000-7499
    11.3849
    ≥7500
    11.3314
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 2电路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度8.13毫米( 0.320 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 8.13mm (.320), with Kinked PC Tails
    9766
    20-49
    0.6075
    50-99
    0.5625
    100-299
    0.5400
    300-499
    0.5220
    500-999
    0.5085
    1000-4999
    0.4995
    5000-9999
    0.4905
    ≥10000
    0.4815
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 36电路,锡(Sn )镀层,配合针脚长度8.13毫米( 0.320 ) 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 36 Circuits, Tin (Sn) Plating, Mating Pin Length 8.13mm (.320)
    6753
    10-99
    6.4560
    100-499
    6.1332
    500-999
    5.9180
    1000-1999
    5.9072
    2000-4999
    5.8642
    5000-7499
    5.8104
    7500-9999
    5.7674
    ≥10000
    5.7458
  • 品牌: Molex (莫仕)
    封装: Solder
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 34电路, 0.76μm ( 30μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( 0.240 ) 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240)
    5701
    5-49
    11.9925
    50-199
    11.4800
    200-499
    11.1930
    500-999
    11.1213
    1000-2499
    11.0495
    2500-4999
    10.9675
    5000-7499
    10.9163
    ≥7500
    10.8650
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 3电路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度7.49毫米( 0.295 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 7.49mm (.295), with Kinked PC Tails
    3319
    10-49
    0.8370
    50-99
    0.7936
    100-299
    0.7626
    300-499
    0.7440
    500-999
    0.7254
    1000-2499
    0.7068
    2500-4999
    0.6789
    ≥5000
    0.6727
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 3电路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度8.13毫米( 0.320 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 8.13mm (.320), with Kinked PC Tails
    8973
    10-49
    0.9045
    50-99
    0.8576
    100-299
    0.8241
    300-499
    0.8040
    500-999
    0.7839
    1000-2499
    0.7638
    2500-4999
    0.7337
    ≥5000
    0.7270
  • 描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 2回路,锡(Sn )镀层,配合针脚长度6.09毫米( 0.240 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 2 Circuits, Tin (Sn) Plating, Mating Pin Length 6.09mm (.240), with Kinked PC Tails
    6157
    20-49
    0.6075
    50-99
    0.5625
    100-299
    0.5400
    300-499
    0.5220
    500-999
    0.5085
    1000-4999
    0.4995
    5000-9999
    0.4905
    ≥10000
    0.4815
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 3电路, 0.76μm ( 30μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( 0.240 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240), with Kinked PC Tails
    9487
    10-49
    1.2960
    50-99
    1.2288
    100-299
    1.1808
    300-499
    1.1520
    500-999
    1.1232
    1000-2499
    1.0944
    2500-4999
    1.0512
    ≥5000
    1.0416
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK ?头,分离式,立式, 2电路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( 0.240 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240), with Kinked PC Tails
    7464
    20-49
    0.6075
    50-99
    0.5625
    100-299
    0.5400
    300-499
    0.5220
    500-999
    0.5085
    1000-4999
    0.4995
    5000-9999
    0.4905
    ≥10000
    0.4815
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 2回路,锡(Sn )镀层,配合针脚长度8.13毫米( 0.320 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 2 Circuits, Tin (Sn) Plating, Mating Pin Length 8.13mm (.320), with Kinked PC Tails
    6295
    20-49
    0.4995
    50-99
    0.4625
    100-299
    0.4440
    300-499
    0.4292
    500-999
    0.4181
    1000-4999
    0.4107
    5000-9999
    0.4033
    ≥10000
    0.3959
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 4回路, 0.76μm ( 30μ ),金(Au )选择性镀层,配合针脚长度7.49毫米( 0.295 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Mating Pin Length 7.49mm (.295), with Kinked PC Tails
    5771
    5-24
    2.0520
    25-49
    1.9000
    50-99
    1.7936
    100-499
    1.7480
    500-2499
    1.7176
    2500-4999
    1.6796
    5000-9999
    1.6644
    ≥10000
    1.6416
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 4回路, 0.76μm ( 30μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( .240 “ ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240"), with Kinked PC Tails
    5616
    5-24
    1.7550
    25-49
    1.6250
    50-99
    1.5340
    100-499
    1.4950
    500-2499
    1.4690
    2500-4999
    1.4365
    5000-9999
    1.4235
    ≥10000
    1.4040
  • 描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 2电路, 0.76μm ( 30μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( 0.240 ) 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240)
    1713
    10-49
    1.0530
    50-99
    0.9984
    100-299
    0.9594
    300-499
    0.9360
    500-999
    0.9126
    1000-2499
    0.8892
    2500-4999
    0.8541
    ≥5000
    0.8463
  • 描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 3电路,锡(Sn )镀层,配合针脚长度7.49毫米( 0.295 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 3 Circuits, Tin (Sn) Plating, Mating Pin Length 7.49mm (.295), with Kinked PC Tails
    4110
    10-49
    0.6885
    50-99
    0.6528
    100-299
    0.6273
    300-499
    0.6120
    500-999
    0.5967
    1000-2499
    0.5814
    2500-4999
    0.5585
    ≥5000
    0.5534
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 3电路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( 0.240 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240), with Kinked PC Tails
    5493
    10-49
    1.2285
    50-99
    1.1648
    100-299
    1.1193
    300-499
    1.0920
    500-999
    1.0647
    1000-2499
    1.0374
    2500-4999
    0.9965
    ≥5000
    0.9874
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 4回路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( 0.240 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240), with Kinked PC Tails
    9660
    10-49
    1.1475
    50-99
    1.0880
    100-299
    1.0455
    300-499
    1.0200
    500-999
    0.9945
    1000-2499
    0.9690
    2500-4999
    0.9308
    ≥5000
    0.9223
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 7电路,锡(Sn )镀层,配合针脚长度7.49毫米( 0.295 “ ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 7 Circuits, Tin (Sn) Plating, Mating Pin Length 7.49mm (.295"), with Kinked PC Tails
    7899
    5-24
    1.6740
    25-49
    1.5500
    50-99
    1.4632
    100-499
    1.4260
    500-2499
    1.4012
    2500-4999
    1.3702
    5000-9999
    1.3578
    ≥10000
    1.3392
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 5电路, 0.76μm ( 30μ ),金(Au )选择性镀层,配合针脚长度7.49毫米( 0.295 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Mating Pin Length 7.49mm (.295), with Kinked PC Tails
    4178
    5-24
    2.6460
    25-49
    2.4500
    50-99
    2.3128
    100-499
    2.2540
    500-2499
    2.2148
    2500-4999
    2.1658
    5000-9999
    2.1462
    ≥10000
    2.1168
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 5电路,锡(Sn )镀层,配合针脚长度7.49毫米( 0.295 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 5 Circuits, Tin (Sn) Plating, Mating Pin Length 7.49mm (.295), with Kinked PC Tails
    4838
    10-49
    1.1880
    50-99
    1.1264
    100-299
    1.0824
    300-499
    1.0560
    500-999
    1.0296
    1000-2499
    1.0032
    2500-4999
    0.9636
    ≥5000
    0.9548
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距KK®头,分离式,立式, 6电路, 0.38μm ( 15μ ),金(Au )选择性镀层,配合针脚长度6.09毫米( 0.240 ) ,与斜塔PC尾巴 2.54mm (.100) Pitch KK® Header, Breakaway, Vertical, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Mating Pin Length 6.09mm (.240), with Kinked PC Tails
    1160
    5-24
    1.7550
    25-49
    1.6250
    50-99
    1.5340
    100-499
    1.4950
    500-2499
    1.4690
    2500-4999
    1.4365
    5000-9999
    1.4235
    ≥10000
    1.4040

©Copyright 2013-2025 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空