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品类: 电子元器件分类描述: SOLDER PASTE, MP200, 500G; Material Composition: 62% Tin, 36% Lead, 2% Silver Alloy, (179℃ Liquidus); Melting Temper...28311+¥803.939410+¥775.731050+¥772.2050100+¥768.6789150+¥763.0372250+¥758.1008500+¥753.16431000+¥747.5226