描述:
Molex Micro-Fit 3.0 3.0mm Single Row Right Angle Headers, 43650 Series Micro-Fit 3.0™ single row right angle wire to board PCB headers with a 3.0mm pitch which form part of a high density low power connector system. These Micro-Fit 3.0™ right angle header connectors have high-temperature UL 94V-0 LCP housings which can withstand high temperature 265°C IR reflow processes, the housings are polarized to prevent accidental mismating, positive-locking prevents accidental disconnects and a snap-in peg locks the header to the PCB for secure retention. The contacts of these Micro-Fit 3.0™ headers are tin or gold plated (part numbers xxxx-xx01 have 15μ gold plating , xxxx-xx02 have 30μ gold plating). These Micro-Fit 3.0™ right angle headers are glow-wire compatible and the through hole versions are also surface mount compatible. For mating see series 46345 Micro-Fit 3.0™ single row wire to wire receptacle connectors Typical applications for these Micro-Fit 3.0™ single row PCB headers include military COTS (Commercial Off The Shelf), solar power, consumer products (dryers, freezers, fridges, washing machines), data communications (routers, servers), medical and telecommunications. ### Molex Micro-Fit 3.0 系列 电压额定值 | 250V a.c. (rms) 或 176Vd.c. | 触点电阻 | 最大 10mΩ ---|---|---|--- 电流额定值（每触点） | Amps | 绝缘电阻 | 最低 1000 MΩ 20//22 awg | 5 | 介电强度 | 1500V a.c. 24 awg | 4 | 触点材料 | 镀锡磷青铜 26 awg | 3 | 外壳材料 | 聚酯 94V-0 28 awg | 2 | 管座材料 | 高温 LCP 30 awg | 1 | |
