型号/品牌/封装
品类/描述
库存
价格(含税)
资料
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温，电路18 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits34305+￥29.718050+￥28.4480200+￥27.7368500+￥27.55901000+￥27.38122500+￥27.17805000+￥27.05107500+￥26.9240 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 18电路， 0.76μm （ 30μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating78035+￥31.086950+￥29.7584200+￥29.0144500+￥28.82851000+￥28.64252500+￥28.42995000+￥28.29717500+￥28.1642 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 10电路， 0.38μm （ 15μ ）金（ Au）的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating10075+￥15.666350+￥14.9968200+￥14.6219500+￥14.52821000+￥14.43442500+￥14.32735000+￥14.26047500+￥14.1934 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 30电路， 0.38μm （ 15μ ）金（ Au）的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating22221+￥41.785010+￥39.3875100+￥37.6065250+￥37.3325500+￥37.05851000+￥36.75032500+￥36.47635000+￥36.3050 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 32电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating12031+￥52.460010+￥49.4500100+￥47.2140250+￥46.8700500+￥46.52601000+￥46.13902500+￥45.79505000+￥45.5800 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 14电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating60705+￥18.404150+￥17.6176200+￥17.1772500+￥17.06711000+￥16.95692500+￥16.83115000+￥16.75257500+￥16.6738 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 24电路， 0.38μm （ 15μ ）金（ Au）的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating75995+￥33.602450+￥32.1664200+￥31.3622500+￥31.16121000+￥30.96022500+￥30.73045000+￥30.58687500+￥30.4432 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 32电路， 0.38μm （ 15μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating44371+￥72.427010+￥69.2780100+￥68.7112250+￥68.2703500+￥67.57751000+￥67.26262500+￥66.82185000+￥66.4439 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 24电路， 0.76μm （ 30μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating74681+￥41.565410+￥39.1805100+￥37.4089250+￥37.1363500+￥36.86371000+￥36.55712500+￥36.28465000+￥36.1142 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温，电路24 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits43275+￥32.877050+￥31.4720200+￥30.6852500+￥30.48851000+￥30.29182500+￥30.06705000+￥29.92657500+￥29.7860 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 28电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating66575+￥33.462050+￥32.0320200+￥31.2312500+￥31.03101000+￥30.83082500+￥30.60205000+￥30.45907500+￥30.3160 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温，电路26 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits95355+￥31.086950+￥29.7584200+￥29.0144500+￥28.82851000+￥28.64252500+￥28.42995000+￥28.29717500+￥28.1642 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 30电路， 0.76μm （ 30μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating17121+￥66.136510+￥63.2610100+￥62.7434250+￥62.3408500+￥61.70821000+￥61.42072500+￥61.01815000+￥60.6731 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 22电路， 0.38μm （ 15μ ）金（ Au）的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating42335+￥30.209450+￥28.9184200+￥28.1954500+￥28.01471000+￥27.83402500+￥27.62745000+￥27.49837500+￥27.3692 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 24个回路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating14445+￥29.577650+￥28.3136200+￥27.6058500+￥27.42881000+￥27.25182500+￥27.04965000+￥26.92327500+￥26.7968 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 22电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating87785+￥27.389750+￥26.2192200+￥25.5637500+￥25.39991000+￥25.23602500+￥25.04875000+￥24.93177500+￥24.8146 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 38电路， 0.76μm （ 30μ “），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating57531+￥86.572010+￥82.8080100+￥82.1305250+￥81.6035500+￥80.77541000+￥80.39902500+￥79.87215000+￥79.4204 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 28电路， 0.38μm （ 15μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating35361+￥40.003810+￥37.7085100+￥36.0034250+￥35.7411500+￥35.47881000+￥35.18372500+￥34.92145000+￥34.7574 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 26电路， 0.38μm （ 15μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating14765+￥34.538450+￥33.0624200+￥32.2358500+￥32.02921000+￥31.82262500+￥31.58645000+￥31.43887500+￥31.2912 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 40电路， 0.76μm （ 30μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating58361+￥83.352010+￥79.7280100+￥79.0757250+￥78.5683500+￥77.77101000+￥77.40862500+￥76.90135000+￥76.4664 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 26电路， 0.38μm （ 15μ ）金（ Au）的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating50141+￥37.673610+￥35.5120100+￥33.9062250+￥33.6592500+￥33.41221000+￥33.13422500+￥32.88725000+￥32.7328 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 20电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating66615+￥15.093050+￥14.4480200+￥14.0868500+￥13.99651000+￥13.90622500+￥13.80305000+￥13.73857500+￥13.6740 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温，电路34 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits70151+￥60.158210+￥56.7065100+￥54.1424250+￥53.7479500+￥53.35341000+￥52.90962500+￥52.51525000+￥52.2686 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 26电路， 0.76μm （ 30μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating63311+￥46.396610+￥43.7345100+￥41.7569250+￥41.4527500+￥41.14851000+￥40.80622500+￥40.50205000+￥40.3118 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 36电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating97861+￥43.602810+￥41.1010100+￥39.2425250+￥38.9566500+￥38.67071000+￥38.34902500+￥38.06315000+￥37.8844 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating9895 -
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品类: 插头插座描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating5382 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 28电路， 0.38μm （ 15μ ）金（ Au）的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating61861+￥57.815810+￥54.4985100+￥52.0342250+￥51.6551500+￥51.27601000+￥50.84952500+￥50.47045000+￥50.2334 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 40电路， 0.38μm （ 15μ ）金（ Au）的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating28731+￥77.648010+￥74.2720100+￥73.6643250+￥73.1917500+￥72.44901000+￥72.11142500+￥71.63875000+￥71.2336 -
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品类: 板对板连接器描述: 2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 30电路， 0.38μm （ 15μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating69751+￥42.126610+￥39.7095100+￥37.9139250+￥37.6377500+￥37.36151000+￥37.05072500+￥36.77455000+￥36.6018
