分类:
FPGA(现场可编程门阵列)(1)
CPLD(复杂可编程逻辑器件)(2)
双极(BJT)(1)
数字隔离器(1)
整流器(1)
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接口(1)
单片机(2)
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电子元器件分类(283)
晶振(29)
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(3)
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16位微控制器(1)
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(1)
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(1)
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TVS二极管(1)
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onsemi(2)
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NEXPERIA(1)
Exar Corporation(1)
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Array(1)
VISHAY (威世)(28)
Vishay Dale (威世达勒)(12)
TE Connectivity (泰科)(23)
Vishay Semiconductor (威世)(32)
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Dubilier(7)
ON Semiconductor (安森美)(5)
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Panduit (泛达)(1)
Perkinelmer (珀金埃尔默)(3)
TDK (东电化)(1)
CTS (西迪斯)(4)
ProLight Opto(1)
Molex (莫仕)(3)
Renesas Electronics (瑞萨电子)(3)
Intersil (英特矽尔)(3)
Souriau (苏里奥)(7)
RECOM Power(2)
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Epcos (爱普科斯)(5)
Lapp Kabel(1)
Central Semiconductor(1)
Microchip (微芯)(2)
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Abracon(8)
Waldom(1)
Panasonic (松下)(13)
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Conec(1)
Vishay BC Components (威世)(3)
Instek(1)
Traco Electronic(1)
ITT Corporation (ITT电子)(1)
Setra(3)
WATKINS-JOHNSON(1)
Samsung (三星)(2)
Vishay Draloric(2)
CommScope(3)
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SMC(12)
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Akro-Mils(1)
Square D(1)
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Semtech Corporation(1)
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WECO(1)
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Fairchild (飞兆/仙童)(3)
Schaffner(2)
Cosel(1)
GE (通用电气)(2)
Omron (欧姆龙)(3)
Vicor(3)
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Radiall(1)
AVX (艾维克斯)(3)
Bossard(2)
Knowles Corporation (楼氏)(4)
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Torex Semiconductor (特瑞仕)(2)
Tyco Electronics (泰科)(1)
Gulfsemi(1)
Yageo (国巨)(3)
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KSS (凯士士)(1)
Dwyer Instruments(2)
Raychem(1)
Harwin(1)
PRO Elec(1)
Power(1)
E-Switch(1)
Semikron (赛米控)(1)
Balluff(1)
WAGO(1)
Maxim Integrated (美信)(3)
American Power Conversion (美国电力转换公司)(1)
Meritek(1)
SCI(1)
Weipu(1)
KOA Speer(15)
RS Components(2)
Inventronics(1)
Comchip Technology (上华科技)(1)
NXP (恩智浦)(4)
3M(1)
Connfly (晨翔)(2)
Linear Technology (凌力尔特)(1)
Galaxy Semi-Conductor(1)
Dremec(1)
Hittite(2)
Durakool(1)
National Semiconductor (美国国家半导体)(1)
Mill-Max (仕元机械)(1)
ST Microelectronics (意法半导体)(1)
Taiwan Semiconductor (台湾半导体)(1)
NTE Electronics(2)
Corsair Electrical Connectors(1)
KEMET Corporation (基美)(2)
Cinch Connectivity Solutions(1)
Elantec(1)
AERO(1)
Applied Motion(1)
Philips (飞利浦)(2)
Duratool(1)
AirBorn(3)
TE Connectivity Deutsch (德驰)(1)
Amphenol Anytek(1)
Amphenol PCD(1)
Azoteq(1)
Xantrex(1)
Alpha & Omega Semiconductor (万代半导体)(1)
TR Fastenings(1)
Laird Technologies (莱尔德)(1)
Ricoh (理光)(1)
Hellermann Tyton (海尔曼太通)(1)
Birtcher(1)
Desco(1)
Leader Tech(1)
Schroff (施洛福)(1)
FCI Electronics (法马通)(1)
Altech(1)
Johnson Electric(1)
Carlo Gavazzi (瑞士佳乐)(1)
Littelfuse (力特)(1)
多选
封装:
(197)
HC-49(12)
Panel(4)
BGA(17)
直插,D40xL60mm(1)
0604/1.6*1.0mm(11)
Axial(4)
2010(12)
轴向引线(1)
Solder(5)
1210(20)
Surface Mount(28)
FLGA-25(1)
SMD-4(4)
Panel, Flange(1)
8(2)
Through Hole(19)
SOIC-8(2)
SOP(3)
MSOP-8(1)
Solder, Panel(1)
44(1)
DFN-4(7)
1206(40)
LQFP-64(1)
-(8)
0406 (1016 metric) Reversed(2)
LQFP-100(1)
153(1)
16(1)
TSOP(1)
DIP-20(1)
插件,P=5.08mm(1)
SMD-10(1)
QFPH-48(1)
Disc 10mm(1)
Chassis(2)
SMD(3)
DO-201AE(1)
Flange(1)
HVQCCN(1)
DO-201AD(1)
1812(3)
Conformally Coated(1)
1808(4)
DFN(1)
USPC-6(1)
0402(1)
DIP-16(1)
2312(1)
SOT-25(1)
SMD-8(1)
DO-201(1)
SOT-23-6(1)
Rack(1)
Screw(1)
3(3)
DIP-6(1)
12(4)
SSOP-16(2)
Bulk(1)
VFQFN-16(1)
LCCC(1)
4(1)
PDIP-6(1)
TO-220(1)
SOP-20(1)
SOT-23(1)
Half Brick(1)
0603(1)
40(1)
TSSOP(1)
DIP(1)
SSOP(1)
14(1)
TSSOP-24(1)
VFQFN-24(1)
PC Board(1)
TO-220-3(1)
CDIP(1)
TSSOP-20(1)
SOT-23-5(1)
SO-8(1)
Metal(1)
2.54 mm(1)
22.5mm ±0.4mm(1)
DO-214AB-2(1)
多选
包装:
Tape & Reel (TR)(38)
(378)
Bulk(26)
Tray(7)
Tube(12)
Cut Tape (CT)(6)
Box(4)
Cut Tape(1)
Tape & Box (TB)(1)
Ammo Pack(1)
Each(2)
Tape, Tape & Reel (TR)(2)
Rail(1)
多选
型号/品牌/封装
品类/描述
库存
价格(含税)
资料
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路18 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits
    3430
    5+
    29.7180
    50+
    28.4480
    200+
    27.7368
    500+
    27.5590
    1000+
    27.3812
    2500+
    27.1780
    5000+
    27.0510
    7500+
    26.9240
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 18电路, 0.76μm ( 30μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
    7803
    5+
    31.0869
    50+
    29.7584
    200+
    29.0144
    500+
    28.8285
    1000+
    28.6425
    2500+
    28.4299
    5000+
    28.2971
    7500+
    28.1642
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 10电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
    1007
    5+
    15.6663
    50+
    14.9968
    200+
    14.6219
    500+
    14.5282
    1000+
    14.4344
    2500+
    14.3273
    5000+
    14.2604
    7500+
    14.1934
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 30电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
    2222
    1+
    41.7850
    10+
    39.3875
    100+
    37.6065
    250+
    37.3325
    500+
    37.0585
    1000+
    36.7503
    2500+
    36.4763
    5000+
    36.3050
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 32电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, Tin (Sn) Plating
    1203
    1+
    52.4600
    10+
    49.4500
    100+
    47.2140
    250+
    46.8700
    500+
    46.5260
    1000+
    46.1390
    2500+
    45.7950
    5000+
    45.5800
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 14电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
    6070
    5+
    18.4041
    50+
    17.6176
    200+
    17.1772
    500+
    17.0671
    1000+
    16.9569
    2500+
    16.8311
    5000+
    16.7525
    7500+
    16.6738
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 24电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
    7599
    5+
    33.6024
    50+
    32.1664
    200+
    31.3622
    500+
    31.1612
    1000+
    30.9602
    2500+
    30.7304
    5000+
    30.5868
    7500+
    30.4432
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 32电路, 0.38μm ( 15μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
    4437
    1+
    72.4270
    10+
    69.2780
    100+
    68.7112
    250+
    68.2703
    500+
    67.5775
    1000+
    67.2626
    2500+
    66.8218
    5000+
    66.4439
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 24电路, 0.76μm ( 30μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
    7468
    1+
    41.5654
    10+
    39.1805
    100+
    37.4089
    250+
    37.1363
    500+
    36.8637
    1000+
    36.5571
    2500+
    36.2846
    5000+
    36.1142
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路24 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits
    4327
    5+
    32.8770
    50+
    31.4720
    200+
    30.6852
    500+
    30.4885
    1000+
    30.2918
    2500+
    30.0670
    5000+
    29.9265
    7500+
    29.7860
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 28电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, Tin (Sn) Plating
    6657
    5+
    33.4620
    50+
    32.0320
    200+
    31.2312
    500+
    31.0310
    1000+
    30.8308
    2500+
    30.6020
    5000+
    30.4590
    7500+
    30.3160
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路26 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits
    9535
    5+
    31.0869
    50+
    29.7584
    200+
    29.0144
    500+
    28.8285
    1000+
    28.6425
    2500+
    28.4299
    5000+
    28.2971
    7500+
    28.1642
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 30电路, 0.76μm ( 30μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
    1712
    1+
    66.1365
    10+
    63.2610
    100+
    62.7434
    250+
    62.3408
    500+
    61.7082
    1000+
    61.4207
    2500+
    61.0181
    5000+
    60.6731
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 22电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
    4233
    5+
    30.2094
    50+
    28.9184
    200+
    28.1954
    500+
    28.0147
    1000+
    27.8340
    2500+
    27.6274
    5000+
    27.4983
    7500+
    27.3692
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 24个回路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
    1444
    5+
    29.5776
    50+
    28.3136
    200+
    27.6058
    500+
    27.4288
    1000+
    27.2518
    2500+
    27.0496
    5000+
    26.9232
    7500+
    26.7968
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 22电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
    8778
    5+
    27.3897
    50+
    26.2192
    200+
    25.5637
    500+
    25.3999
    1000+
    25.2360
    2500+
    25.0487
    5000+
    24.9317
    7500+
    24.8146
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 38电路, 0.76μm ( 30μ “),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating
    5753
    1+
    86.5720
    10+
    82.8080
    100+
    82.1305
    250+
    81.6035
    500+
    80.7754
    1000+
    80.3990
    2500+
    79.8721
    5000+
    79.4204
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 28电路, 0.38μm ( 15μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
    3536
    1+
    40.0038
    10+
    37.7085
    100+
    36.0034
    250+
    35.7411
    500+
    35.4788
    1000+
    35.1837
    2500+
    34.9214
    5000+
    34.7574
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 26电路, 0.38μm ( 15μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
    1476
    5+
    34.5384
    50+
    33.0624
    200+
    32.2358
    500+
    32.0292
    1000+
    31.8226
    2500+
    31.5864
    5000+
    31.4388
    7500+
    31.2912
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 40电路, 0.76μm ( 30μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
    5836
    1+
    83.3520
    10+
    79.7280
    100+
    79.0757
    250+
    78.5683
    500+
    77.7710
    1000+
    77.4086
    2500+
    76.9013
    5000+
    76.4664
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 26电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
    5014
    1+
    37.6736
    10+
    35.5120
    100+
    33.9062
    250+
    33.6592
    500+
    33.4122
    1000+
    33.1342
    2500+
    32.8872
    5000+
    32.7328
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 20电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
    6661
    5+
    15.0930
    50+
    14.4480
    200+
    14.0868
    500+
    13.9965
    1000+
    13.9062
    2500+
    13.8030
    5000+
    13.7385
    7500+
    13.6740
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温,电路34 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits
    7015
    1+
    60.1582
    10+
    56.7065
    100+
    54.1424
    250+
    53.7479
    500+
    53.3534
    1000+
    52.9096
    2500+
    52.5152
    5000+
    52.2686
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 26电路, 0.76μm ( 30μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
    6331
    1+
    46.3966
    10+
    43.7345
    100+
    41.7569
    250+
    41.4527
    500+
    41.1485
    1000+
    40.8062
    2500+
    40.5020
    5000+
    40.3118
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 36电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, Tin (Sn) Plating
    9786
    1+
    43.6028
    10+
    41.1010
    100+
    39.2425
    250+
    38.9566
    500+
    38.6707
    1000+
    38.3490
    2500+
    38.0631
    5000+
    37.8844
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
    9895
  • 品牌: Molex (莫仕)
    封装: Through Hole
    品类: 插头插座
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 6电路,锡(Sn )镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
    5382
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 28电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
    6186
    1+
    57.8158
    10+
    54.4985
    100+
    52.0342
    250+
    51.6551
    500+
    51.2760
    1000+
    50.8495
    2500+
    50.4704
    5000+
    50.2334
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 40电路, 0.38μm ( 15μ )金( Au)的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
    2873
    1+
    77.6480
    10+
    74.2720
    100+
    73.6643
    250+
    73.1917
    500+
    72.4490
    1000+
    72.1114
    2500+
    71.6387
    5000+
    71.2336
  • 品牌: Molex (莫仕)
    封装: Through Hole
    描述: 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 30电路, 0.38μm ( 15μ ),金(Au )选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
    6975
    1+
    42.1266
    10+
    39.7095
    100+
    37.9139
    250+
    37.6377
    500+
    37.3615
    1000+
    37.0507
    2500+
    36.7745
    5000+
    36.6018

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