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品类: 电子元器件分类描述: Thermally conductive flame retardant potting and encapsulating compound designed for the bonding and sealing of electrical components where thermal mismatch may occur. Adhesion is excellent to most plastics and substrates. Available in bulk, kits, and cartridge form.12221-9￥105.558510-99￥100.9690100-249￥100.1429250-499￥99.5004500-999￥98.49071000-2499￥98.03172500-4999￥97.3892≥5000￥96.8385
